研究方向
细胞力学。研究细胞的运动、变形，与周围环境的相互作用以及对外部载荷的感应与响应。研究力学环境（刺激）对生物体健康、疾病或损伤的影响。定量理解细胞的力学过程与生物学过程在病理生理学过程-如心血管疾病、肿瘤转移和炎症反应等的相互关系，从而发展有疗效的或有诊断意义的新技术新方法。
生物微纳米技术。研究应用微纳米技术，实现对细胞的精确操控、大规模培养以及细胞内组分的定量分析，为细胞生理、病理过程研究、疾病的诊断与治疗、药物的筛选与设计等提供技术平台；研究开发病原体(微生物、病毒、细胞等)的高效、快速检测微流体芯片。
代表性科研论文
Zhu T, Pei ZH, Huang JY, Xiong CY*, Shi SG, Fang J. Detection of bacterial cells by impedance spectra via fluidic electrodes in microfluidic device. Lab on a Chip. 2010, 10(12), 1557-1560
Huang JY, Zhu T, Pan XC, Qin L, Peng XL, Xiong CY*, Fang J. A high-efficiency digital image correlation method based on fast recursive scheme. Measurement Science and Technology. 2010, 21(3), 035101
Zhu T, Luo CX, Huang JY, Xiong CY*, Ouyang Q, Fang J. Electroporation based on hydrodynamic focusing of microfluidics with low dc voltage. Biomedical Microdevices. 2010, 12(1), 35-40
Huang JY, Pan XC, Peng XL, Zhu T, Qin L, Xiong CY*, Fang J. High-efficiency cell-substrate displacement acquisition via digital image correlation method using basis functions. Optics and Lasers in Engineering. 2009, 10.1016/j.optlaseng.2009.12.009
Huang JY, Peng XL, Qin L, Zhu T, Xiong CY*, Zhang YY, Fang J. Determination of Cellular Tractions on Elastic Substrate Based on an Integral Boussinesq Solution. ASME Journal of Biomechanical Engineering. 2009, 131(6), 061009 (Cover Image)
Huang JY, Qin L, Peng XL, Zhu T, Xiong CY*, Zhang YY, Fang J. Cellular Traction Force Recovery: an Optimal Filtering Approach in Two-Dimensional Fourier Space. Journal of Theoretical Biology. 2009, 259(4), 811-819
Qin L, Huang JY, Xiong CY*, Zhang YY, Fang J. Dynamical stress characterization and energy evaluation of single cardiac myocyte actuating on flexible substrate. Biochemical and Biophysical Research Communications. 2007, 360(2):352-356
Chang S, Wang CS, Xiong CY, Fang J. Nanoscale In-plane Displacement Evaluation by AFM Scanning and Digital Image Correlation Processing. Nanotechnology, 2005, 16(1):344-349
Xiong CY, Zhang J, Li M, Fang J, Yi S. Fourier and wavelet transform analysis of moire fringe patters in electronic packaging. Microelectronics International, 2004, 21(2): 45-51
